Patent Assignment
Reel/Frame 041758/0650
Assignment of Assignor's Interest
Recorded: 2017-02-21
Pages: 3
Assignors
CHANG, KEVIN CHI-WEN
Executed: 2017-02-14
KRYSTCK, WOJCIECH
Executed: 2017-02-15
HENSLEY, DAVID
Executed: 2017-02-17
WILKINSON, WILLIAM
Executed: 2017-02-16
Assignee
II-VI OPTOELECTRONIC DEVICES, INC.
141 MOUNT BETHEL ROAD, WARREN, NEW JERSEY, 07059
Covered Property
(1)
Stress Relief in Semiconductor Wafers
Application:
15/253,373 →
Publication:
US 2017/0148747
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 23, 2017
From: DOPP, DOUGLAS
To: II-VI OPTOELECTRONIC DEVICES, INC.
Reel/Frame 041793/0671 →
Notice of Grant of Security Interest in Patents
Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Patent Release and Reassignment
Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →