IP Library Assignment 041767/0633
Patent Assignment
Reel/Frame 041767/0633

Assignment of Assignor's Interest

Recorded: 2017-03-28 Pages: 3
Assignors
LEW, JEN SERN
Executed: 2017-03-24
THIRUNAVUKARASU, SRISKANTHARAJAH
Executed: 2017-03-23
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Substrate Carrier for Active/Passive Bonding and De-Bonding of a Substrate
Application: 15/291,762 →
Publication: US 2017/0103908
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 30, 2017
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 041798/0823 →