Patent Assignment
Reel/Frame 041776/0820
Assignment of Assignor's Interest
Recorded: 2017-03-29
Pages: 4
Assignor
OKAZAKI, SHUJI
Executed: 2017-03-10
Assignee
SODICK CO., LTD.
3-12-1, NAKAMACHIDAI, TSUZUKI-KU, YOKOHAMA, KANAGAWA, 224-8522, JAPAN
Covered Property
(1)
Lamination Molding Apparatus