IP Library Granted Patent US 10,583,607
Granted Patent B2
US 10,583,607 · App. 15/468,029 · Granted Mar 10, 2020

Lamination molding apparatus

Inventor: Shuji Okazaki (Kanagawa, JP)
Assignee: Sodick Co., Ltd.
B29C64/20B22F3/1055B29C64/153B29C64/188B33Y30/00B22F2003/1056
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Quick Facts
Patent No.
US 10,583,607
App. No.
15/468,029
Granted
Mar 10, 2020
Kind
B2
Abstract

A lamination molding apparatus, including a chamber covering a molding region; a powder layer forming apparatus to form a material powder layer by discharging the material powder onto the molding region and planarizing the material powder on the molding region; a laser beam emitter to emit a laser beam for sintering the material powder to form a sintered body; a cutting machine to cut the sintered body; a horizontal drive device to move both the cutting machine and the powder layer forming apparatus in a horizontal direction parallel to the molding region; a first vertical drive device to reciprocate the cutting machine in a vertical direction orthogonal to the horizontal direction; and a second vertical drive device to reciprocate the powder layer forming apparatus in the vertical direction, is provided.

Claims (12)

1. A lamination molding apparatus, comprising:

a chamber covering a molding region;

a powder layer forming apparatus having a material discharge unit which is a through hole for discharging a material powder onto the molding region and a blade to planarize the material powder on the molding region and form a material powder layer;

a laser beam emitter to emit a laser beam for sintering the material powder to form a sintered body;

a cutting machine to cut the sintered body;

a horizontal driver, the horizontal driver comprising a moving body configured to move simultaneously both the cutting machine and the powder layer forming apparatus on the moving body in a horizontal direction parallel to the molding region;

a first vertical driver, the first vertical driver comprising a guide rail and a linear driver positioned on the guide rail, the first vertical driver provided in the moving body of the horizontal driver and reciprocating independently the cutting machine in a vertical direction orthogonal to the horizontal direction; and

a second vertical driver, the second vertical driver comprising a second guide rail and a second linear driver positioned on the second guide rail, the second vertical driver provided in the moving body of the horizontal driver and reciprocating independently the powder layer forming apparatus in the vertical direction.

2. The apparatus of claim 1 , wherein when cutting the sintered body, the cutting machine is moved vertically downward and the powder layer forming apparatus is moved vertically upward to a position not interfering with the cutting.

3. The apparatus of claim 1 , wherein the powder layer forming apparatus is configured to be capable of switching start and stop of discharge of the material powder.

4. The apparatus of claim 3 , wherein the powder layer forming apparatus further includes a shutter for opening and closing the material discharge unit, and a shutter through-hole accommodating the shutter therein slidably.

5. The apparatus of claim 1 , wherein the molding region has a plurality of local regions in which the material powder layer is formed and sintered with the laser beam, and adjacent two of the local regions in a same height are partially overlapped each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2017
From: OKAZAKI, SHUJI
To: SODICK CO., LTD.
Reel/Frame 041776/0820 →
Priority Claims (1)
JP 2016-058152 · Mar 23, 2016 · national
Continuity (1)
Related Publication 20170274590A1 · Sep 28, 2017