Patent Assignment
Reel/Frame 041784/0537
Assignment of Assignor's Interest
Recorded: 2017-03-29
Pages: 7
Assignors
KIM, DONG-WON
Executed: 2016-12-29
PARK, BONG-TAE
Executed: 2017-01-03
SEONG, HO-JUN
Executed: 2017-01-03
SIM, JAE-HWANG
Executed: 2017-01-03
JUN, JUNG-HOON
Executed: 2017-01-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same