Patent Assignment
Reel/Frame 041796/0151
Assignment of Assignor's Interest
Recorded: 2017-03-30
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Polishing Pad Having Grooves on Bottom Surface of Top Layer