Patent Assignment
Reel/Frame 041798/0804
Assignment of Assignor's Interest
Recorded: 2017-03-30
Pages: 7
Assignors
OH, KYOUNG WHAN
Executed: 2017-03-15
CHOI, YEON WOO
Executed: 2017-03-15
KO, WON YUP
Executed: 2017-03-15
MOON, MIN SEOK
Executed: 2017-03-20
PARK, WON KI
Executed: 2017-03-15
LEE, SEUNG HWAN
Executed: 2017-03-15
CHOI, YONG WON
Executed: 2017-03-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Perforating Device