Patent Assignment
Reel/Frame 041803/0852
Assignment of Assignor's Interest
Recorded: 2017-03-31
Pages: 3
Assignors
JAIN, RAHUL
Executed: 2017-03-14
PARK, JI YONG
Executed: 2017-03-06
LEE, KYU OH
Executed: 2017-03-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die Interconnect Substrates, a Semiconductor Device and a Method for Forming a Die Interconnect Substrate