IP Library Assignment 041818/0074
Patent Assignment
Reel/Frame 041818/0074

Assignment of Assignor's Interest

Recorded: 2017-03-31 Pages: 3
Assignors
CADAG, AARON
Executed: 2017-03-29
RODRIGUEZ, RENNIER
Executed: 2017-03-29
CADAG, ELA MIA
Executed: 2017-03-29
Assignee
STMICROELECTRONICS, INC.
NO. 9 MOUNTAIN DRIVE, LIGHT INDUSTRY &, SCIENCE PARK II, BRGY LA MESA, LAGUNA, CALAMBA CITY, 4027, PHILIPPINES
Covered Property (1)
Flow Over Wire Die Attach Film and Conductive Molding Compound to Provide an Electromagnetic Interference Shield for a Semiconductor Die
Patent: 9,953,933 →
Application: 15/474,904 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 1, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061608/0550 →