Patent Assignment
Reel/Frame 041837/0464
Merger
Recorded: 2017-03-01
Pages: 47
Assignor
NIPPON MINING & METALS CO., LTD.
Executed: 2006-04-03
Assignee
NIPPON MINING HOLDINGS, INC.
10-1, TORANOMON 2-CHOME, MINATO-KU,, TOKYO, 105-0001, JAPAN
Covered Properties
(5)
Packaging Device and Packaging Method for Hollow Cathode Type Sputtering Target
Cathode Material for Lithium Secondary Battery and Manufacturing Method Thereof
Hydrogen Separation Membrane, Sputtering Target for Forming Said Hydrogen Separation Membrane, and Manufacturing Method Thereof
Sb-Te Alloy Sintered Compact Sputtering Target
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Address
Mar 1, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041838/0863 →
Change of Name
Mar 1, 2017
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041952/0324 →
Change of Address
Mar 1, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042104/0228 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →