Patent Assignment
Reel/Frame 041846/0515
Assignment of Assignor's Interest
Recorded: 2017-04-04
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2011-11-16
TSAI, HAO-YI
Executed: 2011-11-16
LII, MIRNG-JI
Executed: 2011-11-16
YU, CHEN-HUA
Executed: 2011-11-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8 LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Fabricating a Post-Passivation Interconnect Structure