Patent Assignment
Reel/Frame 041861/0616
Assignment of Assignor's Interest
Recorded: 2017-04-05
Pages: 7
Assignors
KIM, JUNG-WOO
Executed: 2017-01-23
JUNG, JAE-MIN
Executed: 2017-01-23
PARK, JI-YONG
Executed: 2017-01-27
HA, JEONG-KYU
Executed: 2017-01-27
KIM, WOON-BAE
Executed: 2017-01-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Semiconductor Packages and Display Apparatus Including the Same