IP Library Assignment 041913/0255
Patent Assignment
Reel/Frame 041913/0255

Assignment of Assignor's Interest

Recorded: 2017-03-08 Pages: 4
Assignors
LEE, SANG JIN
Executed: 2017-02-24
LEE, DONG HUN
Executed: 2017-02-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Patent: 9,929,102 →
Application: 15/453,588 →
Publication: US 2018/0090443
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →