Patent Assignment
Reel/Frame 041994/0827
Assignment of Assignor's Interest
Recorded: 2017-04-13
Pages: 11
Assignee
GE EMBEDDED ELECTRONICS OY
KUORTANEENKATU 2, HELSINKI, 00510, FINLAND
Covered Property
(1)
Rigid-Flex Module and Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.