IP Library › Assignment 042008/0087
Patent Assignment
Reel/Frame 042008/0087

Assignment of Assignor's Interest

Recorded: 2017-04-14 Pages: 4
Assignors
YOSHIMURA, TADANORI
Executed: 2017-03-27
KIMURA, TAKUMA
Executed: 2017-03-27
Assignee
KAO CORPORATION
14-10, NIHONBASHI KAYABACHO 1-CHOME, CHUO-KU, TOKYO, 103-8210, JAPAN
Covered Property (1)
Soluble Material for Three-Dimensional Molding
Application: 15/518,910 →
Publication: US 2017/0232684