Patent Assignment
Reel/Frame 042029/0268
Assignment of Assignor's Interest
Recorded: 2017-04-17
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2011-11-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bump Structure Design for Stress Reduction