Patent Assignment
Reel/Frame 042089/0369
Assignment of Assignor's Interest
Recorded: 2017-03-24
Pages: 7
Assignors
CHOI, SEUNG HYUK
Executed: 2017-03-24
HONG, HYUN JUN
Executed: 2017-03-24
KIM, TAE WOOK
Executed: 2017-03-24
RYU, CHEONG HO
Executed: 2017-03-24
KIM, YOUNG SANG
Executed: 2017-03-24
KIM, SUNG JUN
Executed: 2017-03-24
Assignee
ETHERTRONICS, INC.
5501 OBERLIN DRIVE, STE. 100, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Method for Manufacturing a Circuit Having a Lamination Layer Using Laser Direct Structuring Process
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Oct 21, 2016
From: ETHERTRONICS, INC.
To: NH EXPANSION CREDIT FUND HOLDINGS LP
Reel/Frame 040464/0245 →
Security Interest
Aug 11, 2017
From: ETHERTRONICS, INC.
To: SILICON VALLEY BANK
Reel/Frame 044106/0829 →
Release of Security Interest
Jan 31, 2018
From: NH EXPANSION CREDIT FUND HOLDINGS LP
To: ETHERTRONICS, INC.
Reel/Frame 045210/0725 →
Change of Name
May 2, 2023
From: ETHERTRONICS, INC.
To: AVX ANTENNA, INC.
Reel/Frame 063504/0692 →
Change of Name
May 4, 2023
From: AVX ANTENNA, INC.
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 063543/0302 →