Patent Assignment
Reel/Frame 042130/0256
Assignment of Assignor's Interest
Recorded: 2017-04-24
Pages: 3
Assignor
TSAI, CHUNG-HSUAN
Executed: 2017-04-20
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Method of Manufacturing the Same