Patent Assignment
Reel/Frame 042139/0832
Assignment of Assignor's Interest
Recorded: 2017-04-25
Pages: 6
Assignors
PATEL, SAHIL
Executed: 2017-03-22
TONG, RU-YING
Executed: 2017-03-22
SHEN, DONGNA
Executed: 2017-03-22
WANG, YU-JEN
Executed: 2017-03-22
SUNDAR, VINGNESH
Executed: 2017-03-22
Assignee
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Dielectric Encapsulation Layer for Magnetic Tunnel Junction (MTJ) Devices Using Radio Frequency (RF) Sputtering
Patent:
9,935,261 →
Application:
15/479,522 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.