Patent Assignment
Reel/Frame 042161/0598
Assignment of Assignor's Interest
Recorded: 2017-04-27
Pages: 5
Assignors
AOKI, TOYOHIRO
Executed: 2016-09-02
HISADA, TAKASHI
Executed: 2016-09-02
MORI, HIROYUKI
Executed: 2016-09-02
NAKAMURA, EIJI
Executed: 2016-09-12
ORII, YAKSUMITSU
Executed: 2016-09-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method of Forming Solder Bumps