Patent Assignment
Reel/Frame 042165/0364
Assignment of Assignor's Interest
Recorded: 2017-04-27
Pages: 6
Assignors
LEE, WON-IL
Executed: 2017-04-05
JO, CHA-JEA
Executed: 2017-04-05
KIM, JI-HWANG
Executed: 2017-04-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Packages