Patent Assignment
Reel/Frame 042188/0775
Assignment of Assignor's Interest
Recorded: 2017-05-01
Pages: 6
Assignors
LEE, JAEHYUN
Executed: 2017-01-09
KWON, SANGDONG
Executed: 2017-01-09
KIM, TAE-HWA
Executed: 2017-01-09
PARK, MINJOON
Executed: 2017-01-09
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electrostatic Chuck Assembly and Substrate Processing Apparatus Including the Same