Assignment of Assignor's Interest

Recorded: 2017-05-01 Pages: 4

Assignor

DOTSENKO, VLADIMIR V.

Executed: 2014-08-14

Assignee

HYPRES, INC.

175 CLEARBROOK ROAD, ELMSFORD, NEW YORK, 10523

Covered Property (1)

Method for Electrically Interconnecting at Least Two Substrates and Multichip Module

Patent: 10,373,928 →

Application: 15/583,414 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.