Patent Assignment
Reel/Frame 042201/0838
Assignment of Assignor's Interest
Recorded: 2017-05-02
Pages: 6
Assignors
KANG, UN-BYOUNG
Executed: 2017-03-14
KONG, YUNGCHEOL
Executed: 2017-03-21
JUN, HYUNSU
Executed: 2017-03-17
CHOI, KYOUNGSEI
Executed: 2017-03-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same