Patent Assignment
Reel/Frame 042213/0807
Assignment of Assignor's Interest
Recorded: 2017-05-02
Pages: 4
Assignors
LIN, YAN-FU
Executed: 2017-04-14
YU, CHEN-HUA
Executed: 2017-04-19
LEE, MENG-TSAN
Executed: 2017-04-14
WU, WEI-CHENG
Executed: 2017-04-14
CHEN, HSIEN-WEI
Executed: 2017-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fan-Out Package Having a Main Die and Dummy Die, and Method of Forming