Fan-out package having a main die and a dummy die, and method of forming
A method of forming a package and a package are provided. The method includes placing a main die and a dummy die side by side on a carrier substrate. The method also includes forming a molding material along sidewalls of the main die and the dummy die. The method also includes forming a redistribution layer comprising a plurality of vias and conductive lines over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die. The method also includes removing the carrier substrate.
1. A structure, comprising:
one or more main dies;
one or more dummy dies, a dummy die of the one or more dummy dies being positioned beside a main die of the one or more main dies, and the dummy die of the one or more dummy dies comprising a polymer layer disposed over a substrate, the polymer layer defining a surface of the dummy die of the one or more dummy dies;
molding material extending along sidewalls of the one or more main dies and the one or more dummy dies; and
a plurality of redistribution layers comprising a plurality of vias and a plurality of conductive lines, wherein each of the plurality of redistribution layers is disposed at a same level of the structure, the one or more main dies contact a first surface of the plurality of redistribution layers, and the dummy die of the one or more dummy dies is disposed in a manner that the surface of the dummy die defined by the polymer layer is closest to the first surface of the plurality of redistribution layers, and the polymer layer extends between the substrate and the first surface of the plurality of redistribution layers; and
a plurality of external connectors disposed on a second surface of the plurality of redistribution layers, the first surface and the second surface being opposite surfaces of the plurality of redistribution layers.
2. The structure according to claim 1 , wherein an area of the structure in a plan view of the structure is a first area, an area of the structure covered by the one or more main dies and the one or more dummy dies in the plan view of the structure is a second area, and a ratio of the first area to the second area is 2.5 or less.
3. The structure according to claim 1 , wherein the dummy die of the one or more dummy dies comprises a plurality of metal pillars disposed in the polymer layer of the dummy die of the one or more dummy dies.
4. The structure according to claim 3 , wherein the dummy die of the one or more dummy dies does not comprise an electrical connector in the polymer layer of the dummy die of the one or more dummy dies.
5. The structure according to claim 1 , wherein a substrate of the one or more main dies comprises a same material as the substrate of the one or more dummy dies.
6. The structure according to claim 5 , wherein an effective CTE of the one or more main dies is substantially the same as an effective CTE of the one or more dummy dies.
7. The structure according to claim 6 , wherein a thickness of the dummy die of the one or more dummy dies is less than a thickness of a main die of the one or more main dies, wherein the thickness of the main die of the one or more main dies and the dummy die of the one or more dummy dies is measured in a direction that is perpendicular to a major surface of the main die of the one or more main dies.
8. The structure according to claim 1 , wherein the dummy die of the one or more dummy dies comprises electric connectors exposed along the surface of the dummy die that is closest to the first surface of the plurality of redistribution layers.
9. The structure according to claim 8 , wherein a via of the plurality of vias is electrically connected to an electrical connector of the electrical connectors of the dummy die of the one or more dummy dies.
10. The structure according to claim 9 , wherein the via of the plurality of vias electrically connects the electrical connector of the electrical connectors of the dummy die of the one or more dummy dies to a ground node.
11. The structure according to claim 8 , wherein the electrical connectors of the one or more dummy dies are electrically isolated from the plurality of vias and the plurality of conductive lines of the plurality of redistribution layers.
12. The structure according to claim 1 , wherein the molding material covers the surface of the one or more dummy dies that is closest to the first surface of the plurality of redistribution layers.
13. A structure, comprising:
one or more main dies;
one or more dummy dies, a first dummy die of the one or more dummy dies being positioned beside a main die of the one or more main dies;
a plurality of through vias, wherein a through via of the plurality of through vias is positioned beside a second dummy die of the one or more dummy dies;
a molding material extending along sidewalls of the one or more main dies, the one or more dummy dies, and the plurality of through vias; and
a redistribution layer over the one or more main dies and the one or more dummy dies, wherein the redistribution layer comprises a plurality of conductive lines and a plurality of vias, and wherein the plurality of conductive lines are electrically connected to the one or more main dies.
14. The structure according to claim 13 , wherein an area of the structure in a plan view of the structure is a first area, an area of the structure covered by the one or more main dies and the one or more dummy dies in the plan view of the structure is a second area, and a ratio of the first area to the second area is 2.5 or less.
15. The structure according to claim 13 , wherein a thickness of the one or more dummy dies is less than a thickness of the one or more main dies, the thickness of the one or more dummy dies and the thickness of the one or more main dies being measured in a direction that is perpendicular to a major surface of the one or more dummy dies.
16. The structure according to claim 13 , wherein a conductive line of the plurality of conductive lines electrically connects a dummy die of the one or more dummy dies to a ground node.
17. A structure, comprising:
one or more main dies;
one or more dummy dies, wherein a dummy die of the one or more dummy dies is positioned beside a main die of the one or more main dies;
a molding material extending along sidewalls of the one or more main dies and the one or more dummy dies; and
a redistribution layer over the one or more main dies and the one or more dummy dies, wherein the redistribution layer comprises a plurality of conductive lines and a plurality of vias; and
wherein an area of the structure in a plan view of the structure is a first area, an area of the structure covered by the one or more main dies and the one or more dummy dies in the plan view of the structure is a second area, and a ratio of the first area to the second area is 2.5 or less.
18. The structure according to claim 17 , wherein the dummy die of the one or more dummy dies comprises a polymer layer at a surface of the dummy die that is closest to the redistribution layer, wherein electrical connectors do not extend through the polymer layer.
19. The structure according to claim 18 , wherein the polymer layer contacts a dielectric layer, the redistribution layer being disposed in the dielectric layer.
20. The structure according to claim 18 , further comprising a plurality of through vias extending through the molding material, wherein a through via of the plurality of through vias is positioned next to the dummy die of the one or more dummy dies.