Three-dimensional (3D) package
A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
1. A package comprising:
a first package component free of any transistors, the first package component comprising:
an interconnect die;
a passive device die;
a dielectric material surrounding the interconnect die and the passive device die;
first metallization pattern bonded to the interconnect die;
a first underfill between the interconnect die and the first metallization pattern; and
a second underfill between the passive device die and the first metallization pattern, wherein the dielectric material is disposed between the first underfill and the second underfill along a plane that is parallel to a major surface of the first metallization pattern; and
a first device die bonded to an opposing side of the first metallization pattern as the interconnect die;
a second device die bonded to a same side of the first metallization pattern as the first device die, wherein the interconnect die electrically connects the first device die to the second device die; and
a core substrate bonded to an opposing side of the interconnect die as the first metallization pattern, wherein the core substrate comprises:
an insulating core material;
a first metal cladding layer on a first side of the insulating core material; and
a second metal cladding layer on a second side of the insulating core material opposite the first side of the insulating core material.
2. The package of claim 1 , wherein the first package component further comprises:
a second metallization pattern on an opposing side of the dielectric material as the first metallization pattern, wherein the core substrate is bonded to an opposing side of the second metallization pattern as the dielectric material.
3. The package of claim 2 further comprising through vias extending through the dielectric material, wherein the through vias electrically connect the first metallization pattern to the second metallization pattern.
4. The package of claim 1 , wherein the interconnect die is bonded to the first metallization pattern by a plurality of solder regions.
5. The package of claim 4 , wherein the first underfill surrounds the plurality of solder regions.
6. The package of claim 5 , wherein the solder regions are directly bonded to the first metallization pattern, and wherein the first underfill contacts sidewalls of the first metallization pattern.
7. The package of claim 1 , wherein the dielectric material surrounds the first underfill.
8. The package of claim 1 , wherein the dielectric material surrounds the second underfill.
9. The package of claim 1 , wherein the dielectric material is thicker than the interconnect die in a cross-sectional view.
10. The package of claim 1 , wherein the dielectric material contacts a sidewall of the first metallization pattern.
11. A package comprising:
an interposer free of transistors, the interposer comprising:
a local silicon interconnect (LSI) die;
a passive device die;
a dielectric film surrounding the LSI die and the passive device die, wherein the dielectric film extends continuously from a sidewall of the LSI die to a sidewall of the passive device die; and
a first metallization pattern over the dielectric film, the LSI die, and the passive device die, wherein the LSI die and the passive device die are each bonded to a first surface of the first metallization pattern, wherein the passive device die is bonded to the first metallization pattern by first solder connectors, and wherein the LSI die is bonded to the first metallization pattern by second solder connectors;
a first underfill around the first solder connectors, wherein the dielectric film surrounds the first underfill;
a second underfill around the second solder connectors, wherein the dielectric film surrounds the second underfill, and wherein the dielectric film separates the first underfill from the second underfill;
a first device die bonded to a second surface of the first metallization pattern that is opposite to the first surface of the first metallization pattern;
a second device die bonded to the second surface of the first metallization pattern, wherein the LSI die electrically routes signals between the first device die and the second device die; and
a package substrate directly bonded to an opposing side of the interposer as the first device die and the second device die.
12. The package of claim 11 , wherein the interposer further comprises a second metallization pattern under the dielectric film, the LSI die, and the passive device die, wherein the package substrate is directly bonded to the second metallization pattern.
13. The package of claim 11 further comprising a through via extending through the dielectric film.
14. The package of claim 11 , wherein the first device die overlaps the passive device die.
15. The package of claim 11 , wherein the first device die is bonded to the first metallization pattern by third solder connectors, and wherein the second device die is bonded to the first metallization pattern by fourth solder connectors.
16. A semiconductor device comprising:
an interconnect device bonded to a first surface of a first metallization structure, wherein the interconnect device is free of any transistors;
a passive device die bonded to the first surface of the first metallization structure, wherein the passive device die is free of any transistors;
a dielectric film around the interconnect device and the passive device die, the dielectric film extending from the first metallization structure to a second metallization structure;
a first device die bonded to a second surface of the first metallization structure, wherein the second surface of the first metallization structure is opposite to the first surface of the first metallization structure;
a second device die bonded to the second surface of the first metallization structure, wherein the interconnect device is electrically connected to both the first device die and the second device die; and
a core substrate bonded to an opposing side of the second metallization structure as the dielectric film, wherein the interconnect device is solder bonded to the first metallization structure, and wherein a first underfill extends between the interconnect device and the first metallization structure, wherein the passive device die is solder bonded to the first metallization structure, wherein a second underfill extends between the passive device die and the first metallization structure, and wherein the first underfill and the second underfill are physically separated.
17. The semiconductor device of claim 16 further comprising through vias extending through the dielectric film, wherein the through vias electrically connect the first metallization structure to the second metallization structure.
18. The semiconductor device of claim 17 , wherein the first device die overlaps a first through via of the through vias, the passive device die, and the interconnect device.
19. The semiconductor device of claim 18 , wherein the second device die overlaps a second through via of the through vias and the interconnect device.
20. The semiconductor device of claim 16 , wherein the dielectric film separates the first underfill from the second underfill.