Patent Assignment
Reel/Frame 042232/0364
Assignment of Assignor's Interest
Recorded: 2017-05-03
Pages: 9
Assignors
ZHANG, SHENG
Executed: 2017-04-07
DING, WEN-BO
Executed: 2017-04-07
SHENG, ZHI-RUI
Executed: 2017-04-07
HSU, CHIEN-EN
Executed: 2017-04-07
PANG, CHIEN-KEE
Executed: 2017-04-07
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Wafer Level Packaging Method