Patent Assignment
Reel/Frame 042235/0346
Assignment of Assignor's Interest
Recorded: 2017-05-04
Pages: 2
Assignors
CHEN, CHI-MING
Executed: 2013-01-11
LIU, PO-CHUN
Executed: 2013-01-11
YU, CHUNG-YI
Executed: 2013-01-11
TSAI, CHIA-SHIUNG
Executed: 2013-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Structure Having Sets of Iii-V Compound Layers