Patent Assignment
Reel/Frame 042246/0092
Assignment of Assignor's Interest
Recorded: 2017-05-04
Pages: 2
Assignors
TSAI, CHIA-CHING
Executed: 2017-04-21
CHIU, YI-WEI
Executed: 2017-04-21
HSU, LI-TE
Executed: 2017-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Interconnect Structures