Patent Assignment
Reel/Frame 042247/0034
Assignment of Assignor's Interest
Recorded: 2017-05-04
Pages: 5
Assignors
MIYASAKA, AKIRA
Executed: 2014-12-08
TAJIMA, YUTAKA
Executed: 2014-12-08
KAGESHIMA, YOSHIAKI
Executed: 2014-12-08
MUTO, DAISUKE
Executed: 2014-12-08
MOMOSE, KENJI
Executed: 2014-12-08
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Sic Epitaxial Wafer and Method for Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.