Assignment of Assignor's Interest

Recorded: 2017-05-05 Pages: 4

Assignors

LIU, WEN-FANG

Executed: 2017-04-26

LEE, SHAO-CHIEN

Executed: 2017-04-27

TSENG, CHEN-WEI

Executed: 2017-04-26

LI, ZONG-HUA

Executed: 2017-04-27

Assignee

UNIMICRON TECHNOLOGY CORP.

NO.38, XINGBANG RD., KWEI-SAN INDUSTRIAL ZONE, TAOYUAN CITY, 333, TAIWAN

Covered Property (1)

Chip Package Circuit Board Module

Patent: 10,056,356 →

Application: 15/585,166 →