Patent Assignment
Reel/Frame 042254/0969
Assignment of Assignor's Interest
Recorded: 2017-05-05
Pages: 11
Assignors
YU, KAI-HUNG
Executed: 2017-02-10
OIE, MANABU
Executed: 2017-02-14
MAEKAWA, KAORU
Executed: 2017-02-10
WAJDA, CORY
Executed: 2017-02-13
LEUSINK, GERRIT J.
Executed: 2017-02-10
KIKUCHI, YUUKI
Executed: 2017-02-10
KAWASAKI, HIROAKI
Executed: 2017-02-13
NAGAI, HIROYUKI
Executed: 2017-02-13
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Integration of a Self-Forming Barrier Layer and a Ruthenium Metal Liner in Copper Metallization