Patent Assignment
Reel/Frame 042298/0299
Assignment of Assignor's Interest
Recorded: 2017-05-09
Pages: 3
Assignors
LIAO, WEN-SHIANG
Executed: 2017-05-04
KUO, FENG WEI
Executed: 2017-05-04
TUNG, CHIH-HANG
Executed: 2017-05-04
YU, CHEN-HUA
Executed: 2017-05-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Device with Integrated Antenna and Manufacturing Method Thereof