Patent Assignment
Reel/Frame 042333/0009
Assignment of Assignor's Interest
Recorded: 2017-05-11
Pages: 5
Assignors
HOU, HAO-CHENG
Executed: 2017-04-24
LEE, CHIEN-HSUN
Executed: 2017-04-24
LIN, HUNG-JEN
Executed: 2017-04-24
CHENG, JUNG-WEI
Executed: 2017-04-21
WANG, TSUNG-DING
Executed: 2017-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method of Fabricating the Same
Patent:
10,074,604 →
Application:
15/499,903 →