Patent Assignment
Reel/Frame 042390/0126
Assignment of Assignor's Interest
Recorded: 2017-05-16
Pages: 6
Assignors
SHIH, CHIH-YUAN
Executed: 2017-03-17
CHIU, CHIH-HSIEN
Executed: 2017-03-17
CHANG, YUEH-CHIUNG
Executed: 2017-03-17
LIN, TSUNG-LI
Executed: 2017-03-17
TSAI, CHI-PIN
Executed: 2017-03-17
LIN, CHIEN-CHENG
Executed: 2017-03-17
TSAI, TSUNG-HSIEN
Executed: 2017-03-17
CHU, HENG-CHENG
Executed: 2017-03-17
TSAI, MING-FAN
Executed: 2017-03-17
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package Structure and Fabrication Method Thereof