Patent Assignment
Reel/Frame 042408/0859
Assignment of Assignor's Interest
Recorded: 2017-05-17
Pages: 5
Assignors
LOO, HOWE YIN
Executed: 2016-11-18
GOH, ENG HUAT
Executed: 2016-11-15
LIM, MIN SUET
Executed: 2016-11-18
CHEAH, BOK ENG
Executed: 2016-11-18
KONG, JACKSON CHUNG PENG
Executed: 2016-11-18
YONG, KHANG CHOONG
Executed: 2016-11-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package-Bottom Through-Mold via Interposers for Land-Side Configured Devices for System-in-Package Apparatus