Patent Assignment
Reel/Frame 042458/0889
Assignment of Assignor's Interest
Recorded: 2017-05-22
Pages: 4
Assignors
WANG, YU-SHENG
Executed: 2017-04-14
HUNG, CHI-CHENG
Executed: 2017-04-14
KAO, CHEN-YUAN
Executed: 2017-04-14
CHIU, YI-WEI
Executed: 2017-04-14
OU YANG, LIANG-YUEH
Executed: 2017-04-14
PAI, YUEH-CHING
Executed: 2017-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods for Forming Contact Plugs with Reduced Corrosion