Patent Assignment
Reel/Frame 042462/0042
Assignment of Assignor's Interest
Recorded: 2017-05-23
Pages: 4
Assignors
HSU, HUNG-HSIN
Executed: 2017-05-19
LIN, NAN-CHUN
Executed: 2017-05-19
CHANG CHIEN, SHANG-YU
Executed: 2017-05-19
Assignee
POWERTECH TECHNOLOGY INC.
NO.26, DATONG RD., HUKOU TOWNSHIP,, HSINCHU COUNTY, 303, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Manufacturing Method Thereof