Patent Assignment
Reel/Frame 042462/0051
Assignment of Assignor's Interest
Recorded: 2017-05-23
Pages: 4
Assignee
POWERTECH TECHNOLOGY INC.
NO.26, DATONG RD., HUKOU TOWNSHIP,, HSINCHU COUNTY, 303, TAIWAN
Covered Property
(1)
Chip Package Structure with Conductive Pillar and a Manufacturing Method Thereof