Patent Assignment
Reel/Frame 042487/0560
Merger and Change of Name
Recorded: 2017-05-24
Pages: 16
Assignors
MITSUBISHI CHEMICAL CORPORATION
Executed: 2017-04-03
MITSUBISHI RAYON CO., LTD.
Executed: 2017-04-03
Assignee
MITSUBISHI CHEMICAL CORPORATION
1-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(7)
Polycarbonate Resin Composition, Method for Producing Same and Molded Article of This Resin Composition
Interlayer Filler Composition for Three-Dimensional Integrated Circuit
Resin Dispersion, Coating Material, Laminate, and Processes for Their Production
Composition for Interlayer Filler of Layered Semiconductor Device, Layered Semiconductor Device, and Process for Producing Layered Semiconductor Device
Polycarbonate Resin Composition, Method for Producing Same and Molded Article of This Resin Composition
Three-Dimensional Integrated Circuit Laminate, and Interlayer Filler for Three-Dimensional Integrated Circuit Laminate
Semiconductor Light Emitting Device, Backlight, Color Image Display Device and Phosphor to Be Used for Them
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 21, 2015
From: SUGIYAMA, MASAYA; KAWASE, YASUHIRO; IKEMOTO, MAKOTO; KIRITANI, HIDEKI
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 036609/0864 →
Assignment of Assignor's Interest
Jul 8, 2020
From: MITSUBISHI CHEMICAL CORPORATION
To: CITIZEN ELECTRONICS CO., LTD.
Reel/Frame 053144/0422 →
Assignment of Assignor's Interest
Mar 1, 2021
From: CITIZEN ELECTRONICS CO., LTD.
To: CITIZEN ELECTRONICS CO., LTD.; NICHIA CORPORATION
Reel/Frame 055439/0376 →
Confirmatory Assignment
Dec 5, 2023
From: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 065775/0613 →
Nunc Pro Tunc Assignment
Jan 14, 2025
From: CITIZEN ELECTRONICS CO., LTD.
To: NICHIA CORPORATION
Reel/Frame 069847/0593 →