Patent Assignment
Reel/Frame 042493/0992
Assignment of Assignor's Interest
Recorded: 2017-05-24
Pages: 2
Assignor
MAKIYAMA, HIDEKI
Executed: 2017-05-11
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device