Patent Assignment
Reel/Frame 042507/0516
Assignment of Assignor's Interest
Recorded: 2017-05-25
Pages: 4
Assignors
MIYAMOTO, HIRONOBU
Executed: 2017-03-23
NAKAYAMA, TATSUO
Executed: 2017-03-23
TSUBOI, ATSUSHI
Executed: 2017-03-23
OKAMOTO, YASUHIRO
Executed: 2017-03-23
KAWAGUCHI, HIROSHI
Executed: 2017-03-24
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Semiconductor Device