Patent Assignment
Reel/Frame 042509/0242
Assignment of Assignor's Interest
Recorded: 2017-05-25
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Redistribution Pattern and Passivation Patterns and Method of Fabricating the Same