Patent Assignment
Reel/Frame 042549/0439
Assignment of Assignor's Interest
Recorded: 2017-05-31
Pages: 2
Assignors
HUANG, YEN-CHUN
Executed: 2017-05-19
TANG, BANG-TAI
Executed: 2017-05-21
PENG, CHIH-TANG
Executed: 2017-05-19
HUANG, TAI-CHUN
Executed: 2017-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Atomic Layer Deposition of a Dielectric Over a Substrate