Patent Assignment
Reel/Frame 042573/0082
Assignment of Assignor's Interest
Recorded: 2017-06-02
Pages: 8
Assignors
HAN, KYU HEE
Executed: 2017-04-14
BAEK, JONG MIN
Executed: 2017-04-14
NGUYEN, VIET HA
Executed: 2017-04-17
YOU, WOO KYUNG
Executed: 2017-04-14
JANG, SANG SHIN
Executed: 2017-04-14
KIM, BYUNG HEE
Executed: 2017-05-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Air Gap Between Wires and Method for Fabricating the Same