Patent Assignment
Reel/Frame 042580/0834
Assignment of Assignor's Interest
Recorded: 2017-06-02
Pages: 7
Assignors
LIN, YUSHENG
Executed: 2016-07-26
CARNEY, FRANCIS J.
Executed: 2016-07-27
WEN, YENTING
Executed: 2016-07-13
CHEW, CHEE HIONG
Executed: 2016-07-12
ARIPIN, AZHAR
Executed: 2016-07-12
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Embedded Stacked Die Packages and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0594 →
Release of Security Interest in Patents Recorded at Reel 044481, Frame 0594
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064074/0363 →