Patent Assignment
Reel/Frame 064074/0363
Release of Security Interest in Patents Recorded at Reel 044481, Frame 0594
Recorded: 2023-06-23
Pages: 430
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignees
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(78)
Methods and Apparatus for Voltage and Current Calibration
Methods and Apparatus for Voltage and Current Calibration
Method of Separating Electronic Devices Having a Back Layer and Apparatus
Image Sensors with Vertically Stacked Photodiodes and Vertical Transfer Gates
Application:
15/480,076 →
Publication:
US 2018/0294304
Image Sensors with Vertically Stacked Photodiodes and Vertical Transfer Gates
Image Sensors with Diagonal Readout
Application:
15/480,521 →
Publication:
US 2018/0295306
Electronic Device Including a Termination Structure
Automatic Control of Synchronous Rectifier Turn-Off Threshold
System and Method for Controlling Power Converter with Adaptive Turn-on Delay
Multi-Axis Accelerometer with Reduced Stress Sensitivity
Semiconductor Component and Method of Manufacture
Methods and Apparatus for Power Management of a Memory Cell
Image Sensors with High Dynamic Range and Autofocusing Hexagonal Pixels
Application:
15/488,646 →
Publication:
US 2018/0301484
Direct Bonded Copper Semiconductor Packages and Related Methods
Insulated Gate Bipolar Transistor (Igbt) and Related Methods
Regulating Transition Slope Using Differential Output
Method and Circuit for Peak Power in Quasi-Resonant Converters
Motor Control Circuit and Method
Single-Photon Avalanche Diode Image Sensor with Photon Counting and Time-of-Flight Detection Capabilities
Semiconductor Device Having Biasing Structure for Self-Isolating Buried Layer and Method Therefor
Patent:
10,026,728 →
Application:
15/497,443 →
Method of Manufacturing a Common Mode Filter
Process of Forming an Electronic Device Including a Multiple Channel Hemt
Termination Implant Enrichment for Shielded Gate Mosfets
Inductor Current Emulation for Output Current Monitoring
Bypass Charging Circuit and Method
Ramp Generator for Wide Frequency Range Pulse Width Modulator Controller or the Like
Device Including a Sidewall Schottky Interface
Phase-Cut Pre-Regulator and Power Supply Comprising the Same
Power Device and Method of Manufacturing the Same
Led Control Circuit and Method Therefor
Patent:
10,004,118 →
Application:
15/592,722 →
Methods and Apparatus for Measuring Battery Characteristics
Methods and Apparatus for Actuator Control
Patent:
9,964,732 →
Application:
15/595,024 →
Method of Forming a Shallow Pinned Photodiode
Imaging Systems with Flicker Mitigation and High Dynamic Range
Methods and Apparatus for Selective Pixel Readout for Image Transformation
Resonant Power Supply Converter Circit and Method Thererfor
Pattern Layout of Touch Sensor
Power Supply Circuit with Secondary Side to Primary Side Communication
Light Emitting Diode Control Circuit with Wide Range Input Voltage
Auto Addressing Using Functional Connection
Dc-Dc Converter with Dynamic Feedback Loop
Controlling Output Voltage for Power Converter
System and Method for Controlling Output Signal of Power Converter
Overload Protection for Power Converter
Led Driving Device
Multiple Linear Regulation
Direct Transition from a Waveguide to a Buried Chip
Light Emitting Diode Control Circuit with Hysteretic Control and Low-Side Output Current Sensing
Embedded Stacked Die Packages and Related Methods
Methods and Apparatus for a Multi-Cycle Time-Based Adc
Patent:
9,847,786 →
Application:
15/613,418 →
Methods and Apparatus for Controlling a Bias Voltage
Stacked Semiconductor Device Structure and Method
High Dynamic Range and Global Shutter Image Sensor Pixels Having Charge Overflow Signal Detecting Structures
Image Sensor Chip Scale Packages and Related Methods
Electronic Device Including a Temperature Sensor
Semiconductor Package and Related Methods
Offline Power Converter with Integral Line Sensing
Patent:
10,097,082 →
Application:
15/623,810 →
Offline Power Converter with Multiplier
Patent:
10,008,924 →
Application:
15/624,298 →
Led Driver Circuit and Led Driving Method
Communication Circuit for Flyback Power Converter with Synchronous Rectifier
SILICON CARBIDE (SiC) DEVICE WITH IMPROVED GATE DIELECTRIC SHIELDING
Method of Forming Trench Semiconductor Device Having Multiple Trench Depths
Capacitance Liquid Level Sensor
Semiconductor Package with Elastic Coupler and Related Methods
Laterally Diffused Mosfet for Embedded Memory Applications
Patent:
10,043,899 →
Application:
15/632,997 →
Variable Blanking Frequency for Resonant Converters
Shield Indent Trench Termination for Shielded Gate Mosfets
Integrated Circuit Cooling Systems and Related Methods
Application:
62/491,948 →
Variable Resistance Flat Top Vias and Related Methods
Application:
62/503,815 →
Control for Switching Voltage Regualtors and Power Converters
Application:
62/506,679 →
Image Sensor with Near-Infrared and Color Pixels
Application:
62/510,333 →
Electronic Die Singulation Method Using Exposure to Cryogenic Temperature
Application:
62/510,538 →
Light Load Performance of High Frequency Converters
Application:
62/515,959 →
Synchronous Rectifier Turn-on Enable
Application:
62/518,463 →
Input Current Shaping
Application:
62/521,838 →
Methods and Apparatus for Controlling a Constant Current and Constant Voltage
Application:
62/526,074 →
Methods and Apparatus for Focus Control
Application:
62/527,540 →
CISCSP Package and Related Methods
Application:
62/527,787 →
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 4, 2017
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041847/0845 →
Assignment of Assignor's Interest
Apr 4, 2017
From: KAMEI, ATSUSHI; HAYASHI, YASUAKI; YAMAMOTO, KATSUMI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041840/0588 →
Assignment of Assignor's Interest
Apr 4, 2017
From: KAMEI, ATSUSHI; HAYASHI, YASUAKI; YAMAMOTO, KATSUMI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041840/0625 →
Assignment of Assignor's Interest
Apr 5, 2017
From: JANSSENS, JOHAN CAMIEL JULIA; INNOCENT, MANUEL H.; VELICHKO, SERGEY; GEURTS, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041865/0716 →
Assignment of Assignor's Interest
Apr 5, 2017
From: JANSSENS, JOHAN CAMIEL JULIA; INNOCENT, MANUEL H.; VELICHKO, SERGEY; GEURTS, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041865/0653 →
Assignment of Assignor's Interest
Apr 6, 2017
From: CREMERS, BART
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041882/0904 →
Assignment of Assignor's Interest
Apr 7, 2017
From: LOECHELT, GARY H.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041927/0268 →
Assignment of Assignor's Interest
Apr 14, 2017
From: PADMANABHAN, BALAJI; LIU, CHUN-LI; SALIH, ALI; MOENS, PETER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042006/0854 →
Assignment of Assignor's Interest
Apr 14, 2017
From: KIYOZAKI, KENICHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042007/0171 →
Assignment of Assignor's Interest
Apr 17, 2017
From: VAARTSTRA, BRIAN ANTHONY; CHAPMAN, NATHAN WAYNE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042026/0623 →
Assignment of Assignor's Interest
Apr 18, 2017
From: TOLENTINO, ERIK NINO; MANIKAM, VEMAL RAJA; ARIPIN, AZHAR
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042041/0564 →
Assignment of Assignor's Interest
Apr 18, 2017
From: HOSOYA, TAKUMI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042041/0871 →
Assignment of Assignor's Interest
Apr 19, 2017
From: HORSKY, PAVEL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042062/0859 →
Assignment of Assignor's Interest
Apr 19, 2017
From: FINKEL, ALAN DAVID; MESA, ARMANDO GABRIEL, JR.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042068/0808 →
Assignment of Assignor's Interest
Apr 24, 2017
From: OGAWA, TAKASHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042131/0351 →
Assignment of Assignor's Interest
Apr 25, 2017
From: ACAR, CENK; SIMON, BRENTON; MAITY, SANDIPAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042135/0678 →
Assignment of Assignor's Interest
May 19, 2017
From: MOON, SANGCHEOL; KIM, JINTAE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042440/0130 →
Assignment of Assignor's Interest
Aug 3, 2017
From: CHOI, HANGSEOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043191/0277 →
Assignment of Assignor's Interest
Aug 3, 2017
From: MOON, SANGCHEOL; CHOI, HANGSEOK; CHUNG, CHI CHEN; CHEN, CHENG-SUNG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043191/0176 →
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0594 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →