Laterally diffused MOSFET for embedded memory applications

1. A high-voltage MOSFET device that comprises:

a body being a semiconductor of a first conductivity type;

a source region at a source active area and positioned within or adjacent to the body, the source region being a semiconductor of a second conductivity type;

a drift region being a lightly-doped semiconductor of the second conductivity type, the drift region positioned adjacent to the body;

a drain region of the second conductivity type positioned within the drift region and sufficiently doped to provide an ohmic connection with a drain contact, the drain contact having a width dimension that is greater than a width dimension of the drain region; and

a gate overlying at least a portion of the body and at least a portion of the drift region to form a controllable channel between the source region and the drift region,

wherein the portion of the drift region overlaid by the gate is bordered by semiconducting material forming a depletion zone with a reverse-biased PN junction when the controllable channel is off, and

wherein a width dimension of the drift region is sufficiently small for the depletion zone to extend across a full width of the drift region.

2. The high-voltage MOSFET device of claim 1 , wherein the width dimension of the drift region is less than a width dimension of the source active area.

3. The high-voltage MOSFET device of claim 1 , wherein the width dimension of the drain region is less than the width dimension of the drift region, and wherein the width dimension of the drain contact is greater than the width dimension of the drift region.

4. The high-voltage MOSFET device of claim 1 , wherein the gate has a gate contact that overlies the channel.

5. The high-voltage MOSFET device of claim 1 , further comprising:

a drain region of the second conductivity type positioned within the drift region and sufficiently doped to provide an ohmic connection with a drain contact; and

a gate oxide that separates the gate from the body and the drift region;

an isolator that provides an insulating gap between the gate and the drain region, wherein the isolator comprises a trench in the drift region with an oxide fill; and

a lateral diffusion forming a bridge between the source region and the controllable channel,

wherein the source region is sufficiently doped to provide an ohmic connection with a source contact.

6. The high-voltage MOSFET device of claim 1 , wherein the first conductivity type is p-type and the second conductivity type is n-type.

7. The high-voltage MOSFET device of claim 1 , wherein the first conductivity type is n-type and the second conductivity type is p-type.

8. A memory device with high-voltage drivers, the memory device comprising:

a memory array having a cell pitch;

a side-by-side array of high-voltage drivers arranged along one side of the memory array at no more than twice the cell pitch, each of the high-voltage drivers comprising, in a semiconductor bulk of a first conductivity type:

a moderately-doped area of the first conductivity type to serve as a body;

a source region at a source active area, the source region being a semiconductor of a second conductivity type and positioned within or adjacent to the body;

a drift region being a lightly-doped semiconductor of the second conductivity type, the drift region positioned adjacent to the body; and

a gate overlying at least a portion of the body and at least a portion of the drift region to form a controllable channel between the source region and the drift region,

wherein a lateral spacing between source active areas of adjacent high-voltage drivers is smaller than a lateral spacing between drift regions of the adjacent high-voltage drivers.

9. The memory device of claim 8 , wherein in each of the high-voltage drivers:

the portion of the drift region overlaid by the gate is bordered by semiconducting material forming a depletion zone with a reverse-biased PN junction when the controllable channel is off; and

the width dimension of the drift region is sufficiently small for the depletion zone to extend across a full width of the drift region.

10. The memory device of claim 8 , wherein each of the high-voltage drivers further comprises:

a drain region of the second conductivity type positioned within the drift region and sufficiently doped to provide an ohmic connection with a drain contact.

11. The memory device of claim 10 , wherein, in each of the high-voltage drivers, the drain contact has a width dimension that is greater than a width dimension of the drain region.

12. The memory device of claim 11 , wherein in each of the high-voltage drivers:

the width dimension of the drain region is less than the width dimension of the drift region; and

the width dimension of the drain contact is greater than the width dimension of the drift region.

13. The memory device of claim 8 , wherein, in each of the high-voltage drivers, the gate has a gate contact that overlies the channel region.

14. The memory device of claim 8 , wherein each of the high-voltage drivers further comprises:

a drain region of the second conductivity type positioned within the drift region and sufficiently doped to provide an ohmic connection with a drain contact;

a gate oxide that separates the gate from the body and the drift region;

an isolator that provides an insulating gap between the gate and the drain region, wherein the isolator comprises a trench in the drift region with an oxide fill; and

a lateral diffusion forming a bridge between the source region and the controllable channel,

wherein the source region is sufficiently doped to provide an ohmic connection with a source contact.

15. The memory device of claim 8 , wherein the first conductivity type is p-type and the second conductivity type is n-type.

16. The memory device of claim 8 , wherein the first conductivity type is n-type and the second conductivity type is p-type.