Patent Assignment
Reel/Frame 042589/0246
Assignment of Assignor's Interest
Recorded: 2017-06-05
Pages: 3
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Producing Method